300*320mm Area with Digital Control
SUPER REFLOW WAVE OVEN
The INFRARED IC HEATE T962 A is a micro processor controlled reflow-oven. It can be used for effectively soldering various SMD and BGA components.The whole soldering process can be completed automatically and it is very easy to use, This machine uses a powerful infrared emission and circulation of the hot air flow, so the temperature is being kept very accurate and evenly distributed.
A windowed drawer is designed to hold the work-piece,and allows safe soldering techniques and the manipulation of SMDBGA and other small eletronic parts mounted on a PCB assembly. The T962 may be automatically rework solder to correct bad solder joints,remove/replace bad components and complete small engineering models of prototypes.
★. (1) A large infrared soldering area
Effective soldering area:300×320mm;this increases the usage range of this machine drastically and makes it an economical investment.
★. (2) Choice of different soldering cycles
Parameters of eight solderng cycles are pre defined and the entire soldering process can completed automatically from Preheat,Soak and Reflow through to cool down.
★. (3) Special heat up and temperature equalization with all designs
Uses up to 1500 Watts of energy efficient Infrared heating and air circulation to re-flow solder.
★. (4) Ergonomic design,practical and easily operated
Good build quality but at the same time light weight and a small footprint allows the T962 to be easily bench positioned transported or stored.
★. (5) Large number of available functions
The T962 can solder most boss-eyed or double-face PCB boards small parts,for example CHIP,SOP,PLCC,QFP,BGA etc.It is the ideal rework solution from single runs to on-demand small batch production.
★. (6) Technical Specifications
● Maximum soldering area: 300×320mm
● Size: 43×37×26cm
● Packing Size: 50×43×33cm
● Rated Power: 1500W
● Processing Time: 1~8 min
● Power Supply: AC220V/50~60HZ
● Net Weight: 12.5kg
● Gross Weight: 14kg